CORVALLIS, July 10, 2017 – Inpria, a pioneer in high-resolution metal oxide photoresists for extreme ultraviolet lithography (EUV), today announced that it has secured $23.5 million in Series B funding from a stellar syndicate representing leading players from across the semiconductor manufacturing ecosystem. Read entire release.
CORVALLIS, Ore., July 11, 2016– Inpria Corporation, a pioneer in high-resolution photoresists for Extreme Ultraviolet (EUV) lithography, announced plans to scale production of their metal oxide EUV photoresists in a new facility in Corvallis, Oregon. This expansion was funded by the $10M+ financing round the company closed earlier this year. Read entire release.
CORVALLIS, Ore., February 20, 2014 – Inpria Corporation, a pioneer in high-resolution photoresists, announced today that it has received $4.7M of a committed $7.3M financing. The round was led by Samsung Venture Investment Corporation, the global investment arm of the Samsung Group, along with significant participation from Intel Capital, Intel’s global investment and M&A organization. Existing investor Applied Ventures, the venture capital arm of Applied Materials, Inc., also participated in the equity financing. Read entire release.