Creating Solutions

Metal Oxide Photoresists: Unlocking the Full Potential of EUV Patterning


For over 50 years, advances and improvements in photolithography (semiconductor patterning) equipment and materials have allowed the semiconductor industry to produce ever more powerful, more power efficient, and more affordable electronic devices.

As part of the photolithography process, photoresists are photosensitive materials that physically record exposure patterns on a silicon wafer as imaged from a mask. Improvements in photolithography equipment have delivered progressively higher resolution images with every generation. To realize these improvements, photoresist performance must keep pace.

Since the early 1990’s all leading-edge commercial photoresists have been the offspring of the same foundational class of organic materials known as Chemically Amplified Resists (CAR). Now, however, as the semiconductor industry moves toward the next generation of imaging technology, Extreme Ultraviolet Lithography (EUVL), the performance requirements are exceeding CAR capabilities and the industry needs a new photoresist platform, one that is purpose-built and optimized specifically for EUVL.


Etched pillars, courtesy IMEC


  Building Blocks

Our core molecules are 5X smaller than conventional materials. These dense, robust building blocks enable crisp and accurate feature sizes below 10nm.

Conventional organic CAR photoresists have core molecules that are large relative to the emerging pattern feature sizes. In contrast, our core molecules are 5X smaller than conventional materials. Furthermore, our molecules are dense, robust building blocks that pack together tightly. This enables us to crisply and accurately pattern features of interest today, and well into the future at sizes below 10nm.

  Photon Capture

Our metal oxide-based materials absorb 4-5X more photons/volume than conventional photoresists making them well-suited for achieving sensitivity targets.

  Etch Selectivity

We put the “resist” back into photoresist! Inpria’s metal oxide materials provide at least 10X higher etch selectivity relative to conventional organic photoresists, resulting in a simpler manufacturing process.

Conventional organic materials have a low etch selectivity, meaning the resist itself is consumed quickly in the etch (pattern transfer) process. As a result, device manufacturers are forced to use a relatively thick layer of photoresist in order to have the pattern survive the etch process. But this leads to patterns with high aspect ratios very prone to pattern collapse. Typical solutions require additional process steps and costs. In comparison, Inpria’s metal oxide materials deliver 10X or higher etch selectivity relative to conventional organic photoresists. In fact our etch selectivity is so high that our photoresist can also displace the need for deposition and etch steps for additional intermediate pattern transfer layers thereby simplifying the manufacturing flow and improving yield.


Working closely with lithography equipment manufacturers, we have demonstrated that our materials are compatible with existing fab equipment.


Inpria photoresists are designed and manufactured specifically to contain the desired active metals and not introduce trace metals at undesirable levels.


About Us

Inpria offers a new approach to photoresists to enable continued scaling of semiconductor device sizes and performance.

Inpria was founded in 2007 as a spin-out from Oregon State University’s Department of Chemistry and the NSF-funded Center for Sustainable Materials Chemistry. Since then we’ve recruited a diverse team with decades of experience working at organizations such as Intel, HP, IMEC, SEMATECH, Kovio, Freeslate, Lawrence Berkeley National Labs, and Los Alamos National Labs.

By focusing on the emerging requirements, Inpria has developed the only purpose-built solution to support EUV lithography at the 7nm process node and beyond.


Jim LaCasse—Chairman & Director; former CEO, NexPlanar (acquired by Cabot Microelectronics)

Andrew Grenville—Director; CEO, Inpria Corporation

Greg Fleming—Director; Investment Director, ALIAD Venture Capital

Dong-Su Kim—Director; Vice President, Samsung Ventures

Chris Progler—Director; CTO, Photronics

Sean Doyle—Observer; Intel Capital

Michael Falcon—Observer; Bandgap Ventures

Eric Johnson—Observer; President, JSR Micro

Tom Kingsley—Observer; Oregon Angel Fund

Taejoon Park—Observer; Applied Ventures

Chris Rosenthal—Observer; TOK



We are always looking for excellent candidates to join our team!
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 2001 NW Monroe Avenue Suite 203
Corvallis, OR 97330 USA